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  Datasheet File OCR Text:
 FRA801G thru FRA807G
8.0 AMPS. Glass Passivated Fast Recovery Rectifiers
FEATURES
Glass passivated chip junction. High efficiency, Low VF High current capability High reliability High surge current capability Low power loss
TO-220AC
.185(4.70) .175(4.44) .412(10.5) MAX DIA .154(3.91) .148(3.74) .27(6.86) .23(5.84) .594(15.1) .587(14.9) .055(1.40) .045(1.14)
.113(2.87) .103(2.62)
MECHANICAL DATA
Cases: TO-220AC Molded plastic Epoxy: UL 94V-0 rate flame retardant Terminals: Pure tin plated, Lead free. Leads solderable per MIL-STD-202, Method 208 guaranteed Polarity: As marked High temperature soldering guaranteed: o 260 C /10 seconds .16", (4.06mm) from case. Mounting position: Any Weight: 2.24 grams
o
PIN1 .16(4.06) .14(3.56)
2
.11(2.79) .10(2.54) .56(14.22) .53(13.46)
.037(0.94) .027(0.68)
.205(5.20) .195(4.95)
.025(0.64) .014(0.35)
PIN 1 PIN 2 CASE
Dimensions in inches and (millimeters)
Pb-free; RoHS-compliant
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%
Type Number
Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current @TC = 55 oC Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 8.0A Maximum DC Reverse Current @ TC=25 oC at Rated DC Blocking Voltage @ TC=125 oC Maximum Reverse Recovery Time ( Note 2 ) Typical Junction Capacitance ( Note 1 ) T J=25 Typical Thermal Resistance (Note 3) Operating and Storage Temperature Range
Symbol FRA VRRM VRMS VDC I(AV) IFSM VF IR Trr Cj RJA
TJ ,TSTG
801G
FRA 802G
FRA 803G
FRA 804G
FRA 805G
FRA 806G
FRA 807G
Units
V V V A A V uA uA nS pF o C/W o C
50 35 50
100 70 100
200 140 200
400 280 400 8.0 150 1.3 5.0 100
600 420 600
800 560 800
1000 700 1000
150
250 50 3.0 -65 to +150
500
Notes:
1. Measured at 1 MHz and Applied Reverse Voltage of 4.0 Volts D.C. 2. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 3. Thermal Resistance from Junction to Case, with Heatsink size 2" x 3" x 0.25" Al-Plate.
09/18/2007 Rev.1.00
www.SiliconStandard.com
1
FRA801G thru FRA807G
RATINGS AND CHARACTERISTIC CURVES (FRA801G THRU FRA807G)
10
FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE
100
FIG.2- TYPICAL REVERSE CHARACTERISTICS
AVERAGE FORWARD CURRENT. (A)
8 40
INSTANTANEOUS REVERSE CURRENT. ( A)
6
Tj=125 0C
10
4
2
4 2 1
Tj=75 0C
0 0 50 100 o CASE TEMPERATURE. ( C) 150
FIG.3- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT
150
0.4 0.2
PEAK FORWARD SURGE CURRENT. (A)
Tj=25 0C
125
TJ=125 0C
8.3ms Single Half Sine Wave JEDEC Method
0.1 0 20 40 60 80 100 120 140
100
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
75
50 400 25 200 0 NUMBER OF CYCLES AT 60Hz 100
FIG.5- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT. (A)
1
2
5
10
20
50
100
FIG.4- TYPICAL JUNCTION CAPACITANCE
120 Tj=25 0C f=1.0MHz Vsig=50mVp-p
40 20 10
100
CAPACITANCE.(pF)
80
4 2 1
60
40
0.4 20 0.2 0.1 0.6
Tj=25oC Pulse Width=300 s 1% Duty Cycle
0.8 1.0 1.2 1.4 1.6 1.8 2.0
0 0.1
0.5
1
5
10
50
100
500 1000
REVERSE VOLTAGE. (V)
INSTANTANEOUS FORWARD VOLTAGE. (V)
FIG.6- REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM
50W NONINDUCTIVE 10W NONINDUCTIVE +0.5A (-) DUT (+) 50Vdc (approx) (-) PULSE GENERATOR (NOTE 2) 1W NON INDUCTIVE OSCILLOSCOPE (NOTE 1) (+) 0 -0.25A trr
NOTES: 1. Rise Time=7ns max. Input Impedance= 1 megohm 22pf 2. Rise Time=10ns max. Sourse Impedance= 50 ohms
-1.0A 1cm SET TIME BASE FOR 5/ 10ns/ cm
09/18/2007 Rev.1.00
www.SiliconStandard.com
2
FRA801G thru FRA807G
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
09/18/2007 Rev.1.00
www.SiliconStandard.com
3


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